Capabilities & Processes

The Amitron Corporation team of professionally trained CAD/CAM engineers assure a seamless transition of your engineering data to the manufacturing floor. The following information outlines our engineering and manufacturing capabilities. Click here for a more complete Equipment List.

Data Formats

Gerber RS-274-X (imbedded apertures) DXF PDF HPGL Autocad ASCII or EIA NC drill files

CAM Capabilities

Dual photo plotters in-house Valor Genesis software Micro-modifications performed with customer approval Panel/array optimization available Pre-manufacturing design checks on every part Artwork generation from bare boards or blueprints Net list test fixture generation

Process Options

Solder mask over bare copper Gold plating Carbon ink OSP White tin Solder mask: LPI & SR1000 CNC skip scoring

Process Capabilities

Laminate Types: CEM-1, CEM-3, FR-4, FR-406, FR-5 (all UL94V-0 rated), Arlon, Rogers, Thermagon, Nelco Laminate Thickness: 0.004" to 0.250" Copper Weight: 1/2 ounce to 12 ounce, finished Layer Count: Single, Double, 4, 6, 8, 10, 12 Line & Space Widths: 0.005"/0.005"

Mechanical Process Tolerances	Minimum annular ring	+/- 0.005"
	Board edge to edge, routed	+/- 0.005"
	Tooling hole to hole:	+/- 0.002"
	Hole to hole:	+/- 0.002"
	Tooling hole to edge:	+/- 0.005"
	Holes to copper registration:	+/- 0.005"
	Copper to solder mask:	+/- 0.005"
	Holes to legend:	+/- 0.010"
	Top to bottom registration:	+/- 0.005"
	Image line tolerance:	90% art work
	Scoring tolerance:	+/- 0.005"
	Edge to copper:	+/- 0.010"
	Solder mask clearance:	0.005"
	Minimum hole size:	0.010"
	Minimum inside radius:	0.015"
	Minimum trace width:	0.005"
	Hole to hole clearance:	0.015"
	Pad to pad clearance:	0.007"
	Hole to board edge:	0.020"
	Hole diameter:	+/- 0.0025"
	Board thickness:	+/- 0.007"